发明名称 |
Lead-frame for electonic devices with extruded pads |
摘要 |
A lead-frame for electronic devices is proposed; the lead-frame is produced from a metal plate and includes a bearing structure arranged in a first plane, and for each electronic device a support element spaced apart from the first plane having a first surface facing the bearing structure for mounting at least one chip and an opposed second surface for being exposed from the electronic device, the second surface being arranged in a second plane, and a plurality of interconnection elements connecting the support element to the bearing structure. For each electronic device the lead-frame further includes an intermediate area between the support element and the interconnection elements, the intermediate area being arranged in a third plane between the first and the second planes. |
申请公布号 |
US2005189625(A1) |
申请公布日期 |
2005.09.01 |
申请号 |
US20050042475 |
申请日期 |
2005.01.24 |
申请人 |
DEODATO CLAUDIO;CASATI PAOLO |
发明人 |
DEODATO CLAUDIO;CASATI PAOLO |
分类号 |
H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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