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发明名称
Method for forming a trench in semiconductor device
摘要
申请公布号
KR100511680(B1)
申请公布日期
2005.08.31
申请号
KR20030049295
申请日期
2003.07.18
申请人
发明人
分类号
H01L21/76;(IPC1-7):H01L21/76
主分类号
H01L21/76
代理机构
代理人
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