| 摘要 |
An apparatus and method for manufacturing a heat transfer device for a semiconductor device are provided. The method of manufacturing the heat transfer device may include at least providing a composite material film having uniformly dispersed metal powder and binder powder and a region intended for a fluid channel packed with a packing material, melting the binder powder by heating the composite material film, pressing the metal powder, sintering the metal powder to form the thin film metal sintered body, and forming the fluid channel inside the thin film metal sintered body by removing the packing structure. |
