发明名称 CURABLE RESIN COMPOSITION AND PRODUCTS OF CURING THEREOF
摘要 The invention provides a thermosetting resin composition capable of giving a product of curing reduced in cure shrinkage. The thermosetting resin composition comprises an alicyclic epoxy compound (a) represented by the general formula (1), a cationic polymerization initiator (i), a surfactant (e), and, if necessary, a polyol (b) having two or more hydroxyl groups at the ends: (1) wherein R1 to R10 are each hydrogen or a saturated or unsaturated C1-20 hydrocarbon group with the proviso that an ether linkage, an ester linkage, or an alcoholic hydroxyl group may be contained in the hydrocarbon group, or R1 to R10 may be each a residue derived from a compound represented by the general formula (1) by the removal of one of R1 to R10, or a residue derived therefrom by the removal of hydrogen from one of R 1 to R10, the wording "in the hydrocarbon group" meaning "inside the hydrocarbon group", "at the end of the hydrocarbon group", or "as the connection of the hydrocarbon group".
申请公布号 KR20050087855(A) 申请公布日期 2005.08.31
申请号 KR20057011952 申请日期 2005.06.24
申请人 DAICEL CHEMICAL INDUSTRIES, LTD. 发明人 MAESHIMA HISASHI
分类号 C09K3/10;C08G59/24;C08G59/32;C08K5/00;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08G59/24;C08G59/68 主分类号 C09K3/10
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