| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and a device for mounting semiconductor chip by which a highly reliable semiconductor mounting substrate can be obtained. <P>SOLUTION: In the method of mounting semiconductor chip, a plurality of semiconductor chips are brazed and soldered to the surface of a wiring board by means of a non-contacting type heating source. The heating by means of the heating source is performed by moving the heating source on a straight line in the widthwise direction of the wiring board after the board is fixed. The wiring board is a film-like tape substrate. The heating source can simultaneously heat the plurality of semiconductor chips. The semiconductor chips are arranged on the wiring board in nearly the same direction as the moving direction of the heating source and as the transporting direction of the wiring board. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
