发明名称 |
METHOD OF CUTTING GLASS SUBSTRATE MATERIAL |
摘要 |
A method of cutting a glass substrate material capable of cutting the glass substrate material while forming a mark-off line with a scriber and, in addition, making it hard for chipping to occur so that cutting faces with excellent quality can be provided, comprising a removal step for removing a part or the entire part of the rear surface of the glass substrate material and a scribing step for forming the mark-off line for producing cracking reaching the rear surface of the glass substrate material on the front surface of the glass substrate material.
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申请公布号 |
KR20050086702(A) |
申请公布日期 |
2005.08.30 |
申请号 |
KR20057008873 |
申请日期 |
2003.11.17 |
申请人 |
THK CO., LTD.;BELDEX CORPORATION |
发明人 |
ISHIKAWA HIROKAZU;HAYASHI TOSHIO |
分类号 |
G02F1/1333;C03B33/023;C03B33/037;C03B33/04;C03B33/07;C03C15/00;G09F9/30;H01L51/50;H05B33/02;(IPC1-7):C03B33/037 |
主分类号 |
G02F1/1333 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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