发明名称 METHOD OF CUTTING GLASS SUBSTRATE MATERIAL
摘要 A method of cutting a glass substrate material capable of cutting the glass substrate material while forming a mark-off line with a scriber and, in addition, making it hard for chipping to occur so that cutting faces with excellent quality can be provided, comprising a removal step for removing a part or the entire part of the rear surface of the glass substrate material and a scribing step for forming the mark-off line for producing cracking reaching the rear surface of the glass substrate material on the front surface of the glass substrate material.
申请公布号 KR20050086702(A) 申请公布日期 2005.08.30
申请号 KR20057008873 申请日期 2003.11.17
申请人 THK CO., LTD.;BELDEX CORPORATION 发明人 ISHIKAWA HIROKAZU;HAYASHI TOSHIO
分类号 G02F1/1333;C03B33/023;C03B33/037;C03B33/04;C03B33/07;C03C15/00;G09F9/30;H01L51/50;H05B33/02;(IPC1-7):C03B33/037 主分类号 G02F1/1333
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