| 摘要 |
<p>An exposure apparatus, wherein an exposure is carried out while filling a space between a projection optical system and a substrate with a liquid, enables to suppress deterioration of a device caused by adherent liquid on the substrate. A device manufacturing system (SYS) comprises an exposure apparatus main unit (EX), an interface portion (IF) and a liquid removal unit (100). In the exposure apparatus main unit (EX), a space between a projection optical system (PL) and a substrate (P) is filled with a liquid (50) and an image of a pattern is projected onto the substrate (P) through the projection optical system (PL) and the liquid (50). The interface portion (IF) is arranged between the exposure apparatus main unit (EX) and a coater/developer main unit (C/D) which processes the substrate (P) after exposure. The liquid removal unit (100) removes the liquid (50) adhering to the substrate (P) before the exposed substrate (P) is transferred into the coater/developer main body (C/D) via the interface portion (IF).</p> |
