POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST

摘要

A polymeric compound for photoresist, comprising monomer units having a skeleton of 2,6-dioxabicyclo[3.3.0] octane in its polymer structure. The monomer units having a skeleton of 2, 6-dioxabicyclo[3.3.0]octane comprise monomer units of the formula: (I) wherein R represents hydrogen or methyl. The polymeric compound for photoresist may comprise monomer units having a skeleton of 2,6- dioxabicyclo[3.3.0]octane, monomer units having a group adherent to substrates and monomer units having an acid leaving group. The polymeric compound for photoresist excels in not only substrate adherence, acid leaving capability and dry etching resistance but also a balance of solubility in resist solvents and alkali solubility.