| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin-type semiconductor device which can reduce the manufacturing cost, and to provide its manufacturing method. <P>SOLUTION: The semiconductor device has a sealing body with the upper surface and the lower surface opposite to it; a flat tab which is located inside the sealing body with its lower surface exposed to the lower surface of the sealing body; one or a plurality of flat posts which is located inside the sealing body with its lower surface exposed to the lower surface of the sealing body; a semiconductor chip which is located inside the sealing body and fixed to the upper surface of the tab and a connection means which is located inside the sealing body and electrically connects a pad electrode of the semiconductor chip and the post. The tab and the post are separated electrically by a groove provided to the lower surface of the sealing body. A part of the edges of the tab and the post has an eaves structure, wherein its upper surface edge projects farther out than its lower surface edge for preventing them from easily dropping off from the sealing body. The tab is electrically connected to a prescribed electrode of the semiconductor chip. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
