| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of electronic components capable of preventing conductive particles from being removed from a bump surface by a wet process. <P>SOLUTION: The manufacturing method includes a process for forming a bump 44 on the surface of an electrode pad, a process for fitting a detachable resin film 25 so that the bump 44 is covered, a process for forming an opening 26 of the resin film 25 at an upper portion in the bump 44, a process for scattering the conductive particles 50 onto the surface of the bump 44 (a), a process for sticking the conductive particles 50 onto the surface of the bump 44 by applying a thermoplastic resin 52 (b), and a process for separating a resin film 25 (c). <P>COPYRIGHT: (C)2005,JPO&NCIPI |
