发明名称 SYSTEM AND METHODS FOR HERMETIC SEALING OF POST MEDIA-FILLED MEMS PACKAGE
摘要 This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fill port in the MEMS package with a sealant. Another operation can include depositing a metal cap over the sealant to hermetically seal the fill port.
申请公布号 US2005184382(A1) 申请公布日期 2005.08.25
申请号 US20040783849 申请日期 2004.02.19
申请人 CHEN CHIEN-HUA;HALUZAK CHARLES C.;MICHAEL DONALD 发明人 CHEN CHIEN-HUA;HALUZAK CHARLES C.;MICHAEL DONALD
分类号 H01L21/44;H01L21/48;H01L23/02;H01L23/29;(IPC1-7):H01L23/29 主分类号 H01L21/44
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