发明名称 |
SYSTEM AND METHODS FOR HERMETIC SEALING OF POST MEDIA-FILLED MEMS PACKAGE |
摘要 |
This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fill port in the MEMS package with a sealant. Another operation can include depositing a metal cap over the sealant to hermetically seal the fill port.
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申请公布号 |
US2005184382(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
US20040783849 |
申请日期 |
2004.02.19 |
申请人 |
CHEN CHIEN-HUA;HALUZAK CHARLES C.;MICHAEL DONALD |
发明人 |
CHEN CHIEN-HUA;HALUZAK CHARLES C.;MICHAEL DONALD |
分类号 |
H01L21/44;H01L21/48;H01L23/02;H01L23/29;(IPC1-7):H01L23/29 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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