发明名称 |
Apparatus and method for die attachment |
摘要 |
The invention provides an apparatus for die attachment onto a substrate including non-metallic material, and metallic material that is adapted to receive a die having a eutectic coating. A heating conduit is provided through which the substrate is movable for heating the metallic material to a eutectic bonding temperature to facilitate bonding between the die and the metallic material at a die-attach position. An induction heating device at the die-attach position heats the metallic material of the substrate to the eutectic bonding temperature prior to attaching a die onto the metallic material.
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申请公布号 |
US2005186019(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
US20040785293 |
申请日期 |
2004.02.23 |
申请人 |
ASM ASSEMBLY AUTOMATION LTD. |
发明人 |
LIU DEMING;FU RAN;LAM KUI K.;RAYMOND NG MAN C.;CHEUNG WAI Y. |
分类号 |
H01L21/52;H01L21/00;H01L21/60;H01L23/498;(IPC1-7):A46B11/04;H01L21/44 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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