| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an IC socket that can be inspected by the number of processes equivalent to an inspection device for pressing a conventional package and without pressing the package, and to provide an inspection device of a semiconductor device having the IC socket and the inspection method therefor. <P>SOLUTION: When an operation section 12 is pressed down (-Z direction) by a pressing force P, the tip section of a transmission lever 16b is pressed down, and the transmission lever 16b is rotated with a support shaft fitted to a base end section as a center. As a result, a sliding section 13 is moved in +X direction, and an energization section 13d of the sliding section 13 in contact with an electrode connecting section 14a in a connection terminal 14 energizes the electrode connecting section 14a in the +X direction. As a result, the ball electrode B of the semiconductor device D is held with two electrode connecting sections 14a, 14b and enabling continuity with the connection terminal 14. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
