发明名称 COVERING MATERIAL, COVERING STRUCTURE, AND METHOD FOR SHIELDING ELECTRONIC COMPONENT FROM ELECTROMAGNETIC WAVE
摘要 PROBLEM TO BE SOLVED: To provide a covering material for shielding electronic component from electromagnetic waves that protects an electronic component, which may cause a malfunction upon receiving the influence of an electromagnetic wave or a circuit board mounted with the electronic component, by such a simple system that may not receive the influence of the electromagnetic wave; to provide a covering structure which shields the electronic component from electromagnetic waves and is covered with the covering material; and to provide a method of shielding the electronic component from electromagnetic waves. SOLUTION: The covering material for shielding the electronic component from electromagnetic waves is provided with an adhesive layer having an insulation property in a member having an electromagnetic wave shielding property. The covering structure for shielding electronic component from electromagnetic waves is covered with the covering material on its insulating adhesive layer side in a state where the covering material is brought into contact with the surface of the electronic component. In the method of shielding the electronic component from electromagnetic wave, an electromagnetic wave shielding member is stuck to the electronic component or the circuit board mounted with the component after an adhesive agent having an insulation property is applied to the component or circuit board. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005228937(A) 申请公布日期 2005.08.25
申请号 JP20040036646 申请日期 2004.02.13
申请人 DENKI KAGAKU KOGYO KK 发明人 FUKAZAWA MOTOHARU;OTSUKI SHINJI;CHIBA TAKASHI
分类号 H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K9/00
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