发明名称 |
Haftklebefolie zum Oberflächenschutz beim Schleifen der Rückseite eines Halbleiterplättchens und Verfahren zur Verwendung derselben |
摘要 |
A surface protective sheet for semiconductor wafer, used in wafer back grinding during a process comprising forming grooves on the surface of semiconductor wafer furnished with circuit so that the cutting depth of the grooves be smaller than the thickness of the wafer and grinding the back of the wafer so that the thickness of the wafer is reduced and that the wafer is finally divided into individual chips, the above surface protective sheet comprising a substrate and, superimposed thereon, a pressure sensitive adhesive layer having an elastic modulus of at least 1.0 x 10<5> Pa at 40 DEG C. This surface protective sheet is applicable to a process which enables producing extremely thin IC chips with high yield. |
申请公布号 |
DE69918618(T2) |
申请公布日期 |
2005.08.25 |
申请号 |
DE1999618618T |
申请日期 |
1999.08.17 |
申请人 |
LINTEC CORP., TOKIO/TOKYO;KABUSHIKI KAISHA TOSHIBA, KAWASAKI |
发明人 |
TAKAHASHI, KAZUHIRO;EBE, KAZUYOSHI;TAKYU, SHINYA |
分类号 |
B24C11/00;C08L33/06;C09J4/02;C09J5/00;C09J7/02;C09J155/00;H01L21/301;H01L21/68;(IPC1-7):C09J7/02;H01L21/304;H01L21/302;H01L21/58;B24B7/22;H01L21/784;H01L23/29 |
主分类号 |
B24C11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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