发明名称 |
NOVEL ORGANOSILICON COMPOUND, ORGANOSILICON RESIN HAVING DIOL, AND PROCESSES FOR PRODUCING THESE |
摘要 |
[PROBLEMS] To provide a novel alkoxysilane having a diol protected, an organosilicon resin which has a diol and the composition of which can be easily regulated, and processes for producing these. [MEANS FOR SOLVING PROBLEMS] The alkoxysilane is an organosilicon compound represented by the following formula (1). The organosilicon resin having a diol is one obtained by hydrolyzing/condensing this compound with a polyfunctional alkoxysilane. [Chemical formula 1] (1) (In the formula, R1 to R3 each is C1-6 alkyl or alkoxy; R4 is C2-6 alkylene; and Z is C1-3 alkylene.) The alkoxysilane is produced by subjecting a compound represented by the following formula (4) and a silane compound represented by R1R2R3SiH to a hydrosilylation reaction. [Chemical formula 4] (4) (In the formula, Z is C1-3 alkylene and R5 has a C-C double bond at an end.) The organosilicon resin is produced by the hydrolysis/condensation of a mixture comprising the organosilicon compound represented by the formula (1) and a molecular weight modifier.
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申请公布号 |
WO2005077960(A1) |
申请公布日期 |
2005.08.25 |
申请号 |
WO2005JP01972 |
申请日期 |
2005.02.09 |
申请人 |
TOAGOSEI CO., LTD.;KOMURO, KATSUHIKO;SUZUKI, HIROSHI |
发明人 |
KOMURO, KATSUHIKO;SUZUKI, HIROSHI |
分类号 |
C07F7/18;C08G77/14;C08G77/16;(IPC1-7):C07F7/18 |
主分类号 |
C07F7/18 |
代理机构 |
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代理人 |
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