发明名称 Method of forming wiring, and method of arranging devices and method of manufacturing image display system by using the same
摘要 A method for forming via holes includes placing an insulating layer on a first wiring layer, forming opening portions in the insulating layer, and forming a second wiring layer on the insulating layer. At the time of forming the opening portions, the insulating layer is irradiated with a laser beam with the focus position staggered.
申请公布号 US6933208(B2) 申请公布日期 2005.08.23
申请号 US20020311704 申请日期 2002.12.17
申请人 SONY CORPORATION 发明人 YANAGISAWA YOSHIYUKI;IWAFUCHI TOSHIAKI
分类号 H01L21/28;G09F9/33;H01L21/302;H01L21/48;H01L21/68;H01L21/768;H01L23/31;H01L25/075;H01L33/00;H01L33/20;H01L33/24;H01L33/32;H01L33/38;H01L33/40;H01L33/48;H01L33/54;H01S3/00;H05K3/00;(IPC1-7):H01L21/00;H01L21/30 主分类号 H01L21/28
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