| 发明名称 |
Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same |
| 摘要 |
A semiconductor element is formed in the major surface of a semiconductor chip. Curved surfaces having a radius of curvature of 0.5 to 50 mum are formed at at least some of edges where the side surfaces and backside surface of the semiconductor chip cross. |
| 申请公布号 |
US6933211(B2) |
申请公布日期 |
2005.08.23 |
| 申请号 |
US20040911493 |
申请日期 |
2004.08.05 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KUROSAWA TETSUYA |
| 分类号 |
B24B19/02;H01L21/02;H01L21/301;H01L21/304;H01L21/44;H01L21/68;H01L21/78;H01L23/00;H01L23/04;H01L29/04;H01L29/06;(IPC1-7):H01L21/78 |
主分类号 |
B24B19/02 |
| 代理机构 |
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代理人 |
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