| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for semiconductor, capable of bonding, in a semiconductor device, semiconductor elements to a lead frame at low temperatures, and having good temperature cycling endurance. SOLUTION: The adhesive film for semiconductor comprises a substrate film and adhesive layers formed on both surfaces of the substrate. The adhesive layer is made of an adhesive having a glass transition temperature of≤200°C, a linear expansion coefficient of≤70 ppm and a storage modulus of≤3 GPa, and the total thickness of the adhesive film is 43-57μm. COPYRIGHT: (C)2005,JPO&NCIPI
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