摘要 |
PROBLEM TO BE SOLVED: To deposit a metal layer only at a required part and to form wiring by a simple production process. SOLUTION: The process for producing a wiring board comprises steps for (a) providing a first surfactant 18 in the first and second regions 12 and 14 of a substrate 10, (b) providing a second surfactant 22 in the first region 12 of the substrate 10, (c) providing the second surfactant 22 with a catalyst 30, and (d) depositing a metal layer 34 on the catalyst 30 to form wiring of the metal layer 34 along the first region 12. COPYRIGHT: (C)2005,JPO&NCIPI
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