发明名称 PROCESS FOR PRODUCING WIRING BOARD AND PROCESS FOR FABRICATING ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To deposit a metal layer only at a required part and to form wiring by a simple production process. SOLUTION: The process for producing a wiring board comprises steps for (a) providing a first surfactant 18 in the first and second regions 12 and 14 of a substrate 10, (b) providing a second surfactant 22 in the first region 12 of the substrate 10, (c) providing the second surfactant 22 with a catalyst 30, and (d) depositing a metal layer 34 on the catalyst 30 to form wiring of the metal layer 34 along the first region 12. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005223062(A) 申请公布日期 2005.08.18
申请号 JP20040028116 申请日期 2004.02.04
申请人 SEIKO EPSON CORP 发明人 FURUHATA HIDEMICHI;KIMURA SATOSHI;MARUMO MINORU
分类号 C23C18/28;C23C18/16;H01L21/288;H01L21/302;H01L21/461;H01L21/48;H01L23/12;H01L23/29;H05K3/18;(IPC1-7):H05K3/18 主分类号 C23C18/28
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