| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-curing type paste comprising an inorganic powder, a polyimide precursor and a solvent without using an aromatic heterocyclic compound, sufficiently preventing the reaction between the powder and the resin, having stabilized viscosity, and capable of providing a homogeneous film without a void; and to provide a ceramic electronic component using the resin-curing type paste. SOLUTION: The resin-curing type paste comprising the polyimide precursor, the inorganic powder and the solvent as essential components contains phosphoric acid. The ceramic electronic component is obtained by using the resin-curing type paste. The resin-curing type paste containing the phosphoric acid provides the inorganic powder-containing polyimide precursor paste having excellent viscosity stability and providing a film having good properties. The ceramic electronic component using the resin-curing type paste hardly causes a crack. COPYRIGHT: (C)2005,JPO&NCIPI
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