| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can be produced through a simple process with high yield. <P>SOLUTION: The semiconductor device 25 comprises an optical member 3, a semiconductor element 8 having a major surface formed to face the optical member 3, a plurality of conductive electrode films 4 formed at a circumferential edge on the surface of the optical member 3 facing the semiconductor element 8, a plurality of electrode terminals 10 formed at the circumferential edge on the major surface of the semiconductor element 8 to face the plurality of conductive electrode films 4, respectively, a plurality of metal protrusions 11 formed, respectively, on the plurality of electrode terminals 10 to be bonded to the conductive electrode films 4, an enclosure 19 provided on the plurality of conductive electrode films 4 to surround the semiconductor element 8, a sealant 24 applied between the semiconductor element 8 and the enclosure 19 in order to secure the semiconductor element 8, the enclosure 19 and the optical member 3, and a plurality of outer terminals 7 bonded to the plurality of conductive electrode films 4 and to the outside of the enclosure 19. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
