发明名称 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition which exhibits satisfactory transmittance when a light source of &le;200 nm, specifically F<SB>2</SB>excimer laser light (157 nm) is used, and is excellent in uniformity of application, etching time dependency and development defects, and to provide a pattern forming method using the same. <P>SOLUTION: The positive resist composition comprises (a) a fluorine-containing resin which has fluorine atoms and is decomposed by the action of an acid to increase solubility in an alkaline developer, (b) a compound which generates an acid upon irradiation with an actinic ray or a radiation, (c) a compound of a specified structure and (d) a solvent. The pattern forming method uses the same. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005221960(A) 申请公布日期 2005.08.18
申请号 JP20040032100 申请日期 2004.02.09
申请人 FUJI PHOTO FILM CO LTD 发明人 KANDA HIROMI;MIZUTANI KAZUYOSHI
分类号 G03F7/039;C08F12/14;G03F7/033;H01L21/027 主分类号 G03F7/039
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