| 摘要 |
PROBLEM TO BE SOLVED: To deposit a metal layer only at a required part and to form wiring by a simple production process. SOLUTION: The process for producing a wiring board comprises steps for (a) providing a catalyst 22 in the first and second regions 12 and 14 of a substrate 10, (b) decomposing inter-atomic bonding in the second region 14 of the substrate 10 by irradiating that region through vacuum UV radiation 26, (c) removing the part of the catalyst 22 provided in the second region 14 by cleaning the substrate 10, and (d) depositing a metal layer 36 on the part of the catalyst 22 left in the first region 12 to form wiring of the metal layer 36 along the first region 12. COPYRIGHT: (C)2005,JPO&NCIPI
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