| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces the proportion of the area of an ESD protective circuit to the total area of a semiconductor chip. SOLUTION: The semiconductor device comprises a first semiconductor area (2) connected to a grand wire (8), a second semiconductor area (4) that is formed in an area surrounded by the first semiconductor area (2), a bonding pad area (18) formed on the second semiconductor area (4), a third semiconductor area (13) connected to the bonding pad area (18), fourth semiconductor areas (14-1, 14-2) connected to the bonding pad area (18), and fifth semiconductor areas (16-1, 16-2) that are formed within the fourth semiconductor areas (14-1, 14-2) and connected to a power wire (10). COPYRIGHT: (C)2005,JPO&NCIPI
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