发明名称 |
Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition |
摘要 |
A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition. |
申请公布号 |
US2005181213(A1) |
申请公布日期 |
2005.08.18 |
申请号 |
US20040511659 |
申请日期 |
2004.11.17 |
申请人 |
ISHIKAWA HIROKI;MINE KATSUTOSHI;YAMAKAWA KIMIO;NAKAYOSHI KAZUMI |
发明人 |
ISHIKAWA HIROKI;MINE KATSUTOSHI;YAMAKAWA KIMIO;NAKAYOSHI KAZUMI |
分类号 |
C08K3/08;C08K3/22;C08L83/04;C09K5/14;H01L23/373;(IPC1-7):B32B27/38;B32B9/04;C08L63/00 |
主分类号 |
C08K3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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