| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring apparatus for a head device, which enables a flexible wiring board to be formed of a single-layer substrate, can separately form a single-layer substrate and a multilayer substrate by a flexible wiring board and a subsubtrate, and reduces the area of using the multilayer substrate and therefore is cost-advantageous. <P>SOLUTION: A subsubtrate 15 to which an electric component 13 to be installed in a head device 1 is fitted is mounted on a flexible wiring board 5, the subsubstrate 15 is constituted of a double-surface substrate, and a connection pattern to be connected to a wiring pattern formed on the flexible wiring board 5 is formed on the backside of the subsubstrate 15 facing the flexible wiring board 5. Thus, the single-layer substrate is enough for the flexible wiring board 5 formed into a shape not to be efficiently taken out of a mold, and the range of the multilayer substrate used as the subsubstrate 15 is reduced. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
