| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a module incorporating a component with high density and high connection reliability. <P>SOLUTION: Wiring boards (5 and 5) having at least wiring patterns of two layers and vias are created. A circuit component is mounted on them. A circuit component is prepared where the via is formed on an electric insulating layer (1). The wiring boards (5 and 5) are placed above and below the electric insulating layer (1). Pressing jigs are placed on upper/lower parts. Heating and pressurizing processing is performed by heat pressing, and the circuit component (7) is embedded in the electric insulating layer (1) so as to cure them. Insulating resin (6 and 6) is formed on surfaces of the wiring boards (5 and 5) facing the pressing jigs. The pressing jigs are placed on resin and heat pressing is performed. In the module incorporating the circuit component, the electric insulating layer (1) where the vias are formed in an inner layer is arranged, the wiring boards (5 and 5) where the circuit components (7) are mounted are arranged on both sides, the circuit components (7) are embedded in the electric insulating layer (1), and dummy patterns are formed in the insulating resin layers (6 and 6) or a part where the wiring patterns do not exist on outer surfaces of the wiring boards (5 and 5). <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
