| 发明名称 |
Wafer cutting using laser marking |
| 摘要 |
An embodiment of the present invention includes a chuck, an imaging sensor, and a laser. The chuck holds a wafer having a front side attached to a tape. The imaging sensor obtains a scribe pattern on the front side through the tape. The laser is mounted above the chuck to mark an alignment pattern on a back side of the wafer based on the scribe pattern.
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| 申请公布号 |
US6930276(B2) |
申请公布日期 |
2005.08.16 |
| 申请号 |
US20040777610 |
申请日期 |
2004.02.12 |
| 申请人 |
INTEL CORPORATION |
发明人 |
NEPOMUCENO LAMBERTO V.;ATIENZA, JR. REYNALDO S.;TAAR REGINALD T. |
| 分类号 |
B23K26/03;B23K26/08;B23K26/36;H01L21/301;H01L21/44;H01L21/48;H01L21/50;H01L21/78;(IPC1-7):B23K26/03 |
主分类号 |
B23K26/03 |
| 代理机构 |
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代理人 |
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