| 摘要 |
A thermosetting adhesive for attaching copper foil to another object contains a copolymer of butadiene and acrylonitrile, a phenol-aldehyde type resin and an aliphatic monocarboxylic, or hydroxyl or chlorine substituted monocarboxylic, acid, containing 1-4 carbon atoms, e.g. formic, acetic, lactic, monochloracetic, propionic or butyric acid. The resin may be a condensate of phenol, cresol, xylenol or resorcinol with formaldehyde, acetaldehyde or butyraldehyde; hexamethylene tetramine may be added as a thermosetting agent. The ratio of copolymer to resin may be 20-200%. the acid may form 5-60% of the mixture. According to an example a formulation of 80 parts of ABR having 25 parts of acrylonitrile to 75 parts of butadiene, 100 parts of a cresol-formaldehyde and 15 parts of formic acid dissolved in 800 parts of methyl ethyl ketone is smeared on copper foil untreated for removal of oxide or fat, the ketone is volatilized by heating at 130 DEG C. for 30 min., the sotreated foil is placed on a stack of layers of paper impregnated with a hardenable phenolaldehyde resin, and the assembly is heated for 30 min. at 160 DEG C. in a press. |
