| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To minimize the occurrence of leakage and short circuit in a metallic part which is exposed from a molding resin except a signal terminal and a heat dissipating surface of a heatsink in a semiconductor device which is formed by holding both sides of a semiconductor chip by a pair of heatsinks and is formed by molding by a resin almost entirely. <P>SOLUTION: In the semiconductor device, a lower side heatsink 20 is provided on one surface side of a semiconductor chip 10, and an upper side heatsink 30 is provided on the other side surface side thereof; the semiconductor chip 10 and each of heatsinks 20, 30 are molded by a molding resin 80; and a metallic part 20a is exposed from the molding resin 80 except the signal terminals 21, 31, 60, and a heat dissipating surface of each of the heatsink bodies 20, 30. In the semiconductor device, the metallic part 20a is coated with a resin member 81 which is formed of a resin. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
