| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package that smoothly dissipates heat and never damages a semiconductor chip during molding and a manufacturing method of the same. <P>SOLUTION: The semiconductor package is mounted in and on the substrate, the semiconductor chip electrically connected to the substrate by a bonding means and the semiconductor chip are connected, and the package includes a heat slug formed by a thermal conductive material, and a heat spreader that is partially exposed outside the semiconductor package and is disposed at a distance between the heat slug and a buffer on the heat slug. This allows the thermal dissipation of the semiconductor chip to be quickly and smoothly performed and the semiconductor chip to be stably protected, thereby enabling a user to maintain an excellent performance for a long time. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
