| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to surely embed plating metal into micro-recessed parts without the occurrence of a void by forming a plating film of a more uniform film thickness over the entire surface of a surface to be plated of a substrate even if the substrate has higher sheet resistance. SOLUTION: The plating equipment has a substrate holder 36, a cathode section 38 provided with a sealing material 90 for water-tightly sealing the peripheral edge of a substrate W held by the substrate holder 36 by abutting on the peripheral edge thereof and a cathode electrode 88 for energizing the substrate by coming into contact with the substrate, an anode 98 arranged in the position facing the substrate W, a plating solution impregnant 10 consisting of a water retaining material arranged between the anode 98 and the substrate W and a driving mechanism for relatively driving the plating solution impregnant 10 and the substrate W. The equipment is so constituted as to provide the anode 98 with a potential gradient. COPYRIGHT: (C)2005,JPO&NCIPI
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