| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency module having less insertion loss. SOLUTION: The module is provided with a substrate 3 over which a ground electrode 11 is formed, and a high-frequency module component 2 which has a concave 8 for waveguide tube type waveguide formed on one face and is mounted on the substrate 3 with the one surface contacting on the ground electrode 11. H-surface coupling windows 14, 15 opening in the waveguide tube type waveguide A formed between the ground electrode 11 and the surface of the concave 8 is formed on the ground electrode 11. The substrate 3 is configured in such a way that TEM mode lines 12, 13 are formed on the other surface of the substrate 3, and penetration conductors 16, 17 for short-circuiting the TEM mode lines 12, 13 near the H-surface coupling windows 14, 15 in the ground electrode 11 are formed. COPYRIGHT: (C)2005,JPO&NCIPI
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