发明名称 RADIATION IMAGE SENSOR, AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a radiation image sensor mounted surely on a mount substrate to be fixed while securing a planarity in a relatively wide area of an image sensor part, and a manufacturing method therefor. SOLUTION: A through hole 21 is provided in the mount substrate 20 to be penetrate through from surface to a reverse face. When the image sensor part 1 is mounted on the mount substrate 20 to be fixed by an adhesive 30, pressures of spaces 60, 61 on a surface side (mounting face side) and a reverse face side in the mount substrate 20 are differed to make the pressure get high in the surface side. An atmospheric pressure difference is generated thereby between the surface and the reverse face of the image sensor part 1 through the through hole 21, the image sensor part 1 is pressed onto the mount substrate 20 using the atmospheric pressure difference, and the adhesive 30 is cured for the fixation. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005214808(A) 申请公布日期 2005.08.11
申请号 JP20040022099 申请日期 2004.01.29
申请人 HAMAMATSU PHOTONICS KK 发明人 MORI HARUMICHI;HONDA MASAHIKO;KUSHIMA TATSUJI;FUJITA KAZUKI
分类号 G01T1/20;G01T1/00;H01L27/14;(IPC1-7):G01T1/20 主分类号 G01T1/20
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