| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the possibility of the breakage of an IC chip without costing much labor. <P>SOLUTION: In a thread formed by installing an IC chip 10, which can read out at least information under non-contact state, on a strip-like resin layer 20, a paper layer 50, in which a hole part 51 is formed so as to expose the IC chip 10 beyond the resin layer 20, is laminated on the resin layer 20 and then, by dripping a resin in the hole part 51, a reinforcing member 40 is formed so as to cover the IC chip 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
