| 摘要 |
PROBLEM TO BE SOLVED: To provide a rigid flexible substrate with which a defection rate as a product can be reduced by exchanging the substrate where a fault occurs even if a case when the fault occurs in a part of substrates and the product can be made inexpensive, and to provide a manufacturing method and a correcting method of the substrate. SOLUTION: In the rigid flexible substrate, the flexible printed wiring board (FPC) 13 is bonded to the rigid printed circuit boards (RPC) 11 and 12 through anisotropic conductive adhesive and bonding sheet, and they are electrically connected and integrated. A surplus (bend part) 14 which is bent and overlapped in an N shape in a cross section is formed in FPC 13 for giving a surplus. A plurality of positioning holes 15 are formed on an upper face of FPC 13 along both side parts by leaving prescribed intervals. COPYRIGHT: (C)2005,JPO&NCIPI
|
