发明名称 |
Optical communications module |
摘要 |
In an optical communications module comprising one or more dielectric substrates equipped with an optical transmitter section, an optical receiver section or an optical transceiver section, and a chassis encasing all of them, a metal part is formed on one side of at least one of the dielectric substrates such that the metal part constitutes the whole or a part of the exterior surface of the chassis so that the length of heat conduction from a dielectric substrate with heat-generating components installed thereon can be minimized so as to efficiently release heat through the metal part to outside, curbing a temperature increase within the chassis. Thus, the optical communications module can exhibit excellent performance.
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申请公布号 |
US2005177319(A1) |
申请公布日期 |
2005.08.11 |
申请号 |
US20030628777 |
申请日期 |
2003.07.28 |
申请人 |
FUJIMOTO TAKESHI;KUHARA YOSHIKI;NAKANISHI HIROMI;FUKUDA KEIICHI |
发明人 |
FUJIMOTO TAKESHI;KUHARA YOSHIKI;NAKANISHI HIROMI;FUKUDA KEIICHI |
分类号 |
H01S5/022;G02B6/42;H01L31/02;H01S5/024;H05K1/02;H05K1/14;H05K3/00;(IPC1-7):G06F19/00 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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