| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive paste for ceramic electronic component capable of forming an external conductor having planar surface shape at the end of a ceramic element while suppressing occurrence of pore or crack. SOLUTION: The conductive paste for ceramic electronic component principally comprises metal powder, glass powder and an organic binder brought into paste state by an organic solvent wherein the organic binder principally comprises acryl resin having molecular weight of 10,000-900,000 and urethane acrylate resin having molecular weight of 1,000-20,000. COPYRIGHT: (C)2005,JPO&NCIPI
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