| 发明名称 |
RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE USING THE SAME |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor having excellent tracking resistance and to provide a semiconductor device sealed by using the resin composition for sealing the semiconductor. SOLUTION: The resin composition for sealing the semiconductor comprises at least an epoxy resin, a curing agent, an inorganic filler and a curing accelerator. The resin composition for sealing the semiconductor is characterized in that the epoxy resin contains an alicyclic epoxy resin component A represented by formula (A) (wherein, R<SP>1</SP>denotes a hydrogen atom or an alkyl group; and l is an integer of 12-15) and the curing agent contains a curing agent component B represented by formula (B) (wherein, R<SP>2</SP>is a hydrogen atom or a 1-9C alkyl group; and m is an integer of 0-10). COPYRIGHT: (C)2005,JPO&NCIPI
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| 申请公布号 |
JP2005213299(A) |
申请公布日期 |
2005.08.11 |
| 申请号 |
JP20040018929 |
申请日期 |
2004.01.27 |
| 申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
SUGIYAMA HIROSHI;TOYAMA TAKASHI |
| 分类号 |
C08G59/32;C08G59/62;H01L23/29;H01L23/31;(IPC1-7):C08G59/32 |
主分类号 |
C08G59/32 |
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