发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To improve an accuracy in detecting positioning marks formed on a substrate when positioning takes place for exposure. SOLUTION: In a wafer-shaped SOI substrate 10, an epitaxial silicon layer 22, which is a convex formation material layer, is formed through an epitaxial growth method on a second silicon layer 16 constituting an SOI layer of the mark formation area 150, which is a scribe line area, and then the corresponding epitaxial silicon layer is etched to pattern a convex 22a as a positioning mark. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005217365(A) 申请公布日期 2005.08.11
申请号 JP20040025581 申请日期 2004.02.02
申请人 OKI ELECTRIC IND CO LTD 发明人 DOMAE YASUHIRO
分类号 H01L21/027;H01L21/76;H01L23/544;(IPC1-7):H01L21/027 主分类号 H01L21/027
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