| 摘要 |
PROBLEM TO BE SOLVED: To obtain a pattern collapse measuring method by which the presence or absence of pattern collapse can be found quickly and easily. SOLUTION: The method includes a step wherein a pattern collapse measuring pattern including an evaluation pattern and a fixation pattern is exposed on a resist formed on a wafer, a step to develop the resist, and a step to find the presence or absence of pattern collapse of the evaluation pattern by measuring the change of the position of center of gravity in a pattern collapse measuring pattern developed on the resist. However, the fixation pattern generates no pattern collapse in the developing process. COPYRIGHT: (C)2005,JPO&NCIPI |
