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经营范围
发明名称
Multi-die semiconductor package
摘要
A semiconducting package includes a first capsule, a second capsule and an adhesive within a recess in a surface of the first capsule that secures the first capsule to the second capsule.
申请公布号
US6927497(B2)
申请公布日期
2005.08.09
申请号
US20020226070
申请日期
2002.08.22
申请人
INTEL CORPORATION
发明人
MEYERS JOHN G.
分类号
H01L23/538;H01L25/10;(IPC1-7):H01L23/48
主分类号
H01L23/538
代理机构
代理人
主权项
地址
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