发明名称 Nonvolatile semiconductor memory device and its manufacturing method
摘要 A first diffused layer and a second diffused layer are formed on the major surface of a silicon substrate. A first insulating layer, a second insulating layer or a semiconductor layer, and a third insulating layer are laminated on the major surface of the silicon substrate in the vicinity of the first diffused layer or the second diffused layer and are partially formed. A fourth insulating layer is formed as a gate insulating film. A fifth insulating layer is formed on the side walls of the second insulating layer or the semiconductor layer. In a region of most of a channel, the gate insulating film is formed and a gate electrode is formed so that it covers the gate insulating film and the laminated films. According to this structure, the operating voltage of a flash memory is reduced, the operation is easily sped up and the holding characteristic of information charge can be enhanced.
申请公布号 US6927446(B2) 申请公布日期 2005.08.09
申请号 US20030418057 申请日期 2003.04.18
申请人 NEC ELECTRONICS CORPORATION 发明人 YOSHINO AKIRA
分类号 H01L21/8247;H01L21/28;H01L21/336;H01L21/8246;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L29/76 主分类号 H01L21/8247
代理机构 代理人
主权项
地址