High density interconnection device

摘要

A high density interconnection device includes a high density connector block having a plurality of jacks disposed on the outer surface for common interconnected to a high density connector. A recessed portion formed on the first side surface defines a first multi-faceted surface having a plurality of angularly disposed first surface elements. A projecting portion formed on the second side surface defines a second multi-faceted surface having a plurality of angularly disposed second surface elements. In another embodiment, one group of jacks are defined in a first plane, and another group of jacks are defined in a second plane. The first and second planes are substantially parallel such that the first and second groups of jacks are offset.