FLIP CHIP PACKAGING PROCESS EMPLOYING IMPROVED PROBE TIP DESIGN

摘要

The present invention provides a novel probe tip suited for flip-chip packaging process. The probe tip comprises a needle body; and a stop cylinder having a recess for fittingly accommodating the needle body therein, the needle body being electrically connected to the stop cylinder via a resilient conductive material. The stop cylinder has an annual flat bottom surrounding the needle body for pressing a protruding probe mark on a metal pad scratched by the needle body.