| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize a semiconductor device in which a plurality of electronic components can be mounted in lower height with higher density after the testing without reduction of the manufacturing yield. <P>SOLUTION: An external terminal 9 is provided in a first region in the periphery of a first good semiconductor device 3 having completed individual tests and provided with a first terminal 8 at the rear surface thereof, a flexible circuit board 2 (2a, 2b) where good electronic components 10, 11 are mounted to a second region is fixed with a resin bonding agent, this circuit board 2 is folded to laminate the electronic components 10, 11 on the first semiconductor device 3, and a first terminal 8 of the first semiconductor device 3 and an external terminal 9 of the circuit board 2 are connected to different electrodes on a mother substrate 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
