发明名称 Shared contact for high-density memory cell design
摘要 A new method and structure is created for a multi-transistor SRAM device. Standard processing steps are followed for the creation of CMOS devices of providing a patterned layer of gate material, of performing LDD impurity implants, of creating gate spacers. After the creation of the gate spacers, a new step of photoresist patterning and exposure is added. The mask for this additional step is a modified butt-contact mask, comprising enlarging the conventional butt-contact opening by between about 0.005 mum and 0.2 mum, an effect that can also be achieved by photo over-expose. This modified butt-contact mask exposes a spacer that is adjacent to the butt-contact hole, this spacer is removed. S/D impurity implant is performed after which conventional processing steps are applied for completion of the multi-transistor SRAM device.
申请公布号 US2005164493(A1) 申请公布日期 2005.07.28
申请号 US20050087422 申请日期 2005.03.23
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY 发明人 LIAW JHON-JHY
分类号 H01L21/336;H01L21/8244;H01L23/48;H01L27/11;(IPC1-7):H01L21/824 主分类号 H01L21/336
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