MANUFACTURING METHOD OF MULTILAYER WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To prevent the size of via holes from growing in the case of removing resin members, in a manufacturing method of a multilayer wiring board by which press work is performed to the resin members formed on wires to form the via holes for arranging vias and thereafter the resin members remaining the bottom surfaces of the via holes are removed. SOLUTION: At via connection on the wires 33, hot setting resins 35 whose setting temperatures are higher than that of a resin 36 are provided, and the rein 36 is formed. The press work is performed to the resin 36 by using a mold to form wiring grooves 43 and the via holes 41. The hot setting resins 35 which are not set yet are dissolved by a permanganate solution to remove the resin 42 remaining on the hot setting resin 35. COPYRIGHT: (C)2005,JPO&NCIPI