Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus

摘要

A semiconductor substrate ( 1 ) is secured by suction to a rear face ( 1 b) of a supporting face ( 11 a) of a substrate supporting table ( 11 ). In this event, the thickness of the semiconductor substrate ( 1 ) is made fixed by planarization on the rear face ( 1 b), and the rear face ( 1 b) is forcibly brought into a state free from undulation by the suction to the supporting face ( 11 a), so that the rear face ( 1 b) becomes a reference face for planarization of a front face ( 1 a). In this state, a tool ( 10 ) is used to cut surface layers of Au projections ( 2 ) and a resist mask ( 12 ) on the front face ( 1 a), thereby planarizing the Au projections ( 2 ) and the resist mask ( 12 ) so that their surfaces become continuously flat. This can planarize the surfaces of fine bumps formed on the substrate at a low cost and a high speed in place of CMP.